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Technical specifications | Language |
Weight & dimensions | Depth | 133.3 mm | Height | 44 mm | Weight | 104.9 g | Width | 7.66 mm | Operational conditions | Operating temperature (T-T) | 0 - 85 °C | Storage temperature (T-T) | -55 - 100 °C | Logistics data | Master (outer) case gross weight | 2.66 kg | Master (outer) case height | 147.3 mm | Master (outer) case length | 254 mm | Master (outer) case width | 181.6 mm | Products per master (outer) case | 15 pc(s) | Features | Backlight | Yes | Backlight colour | Multicolour | Buffered memory type | Unregistered (unbuffered) | CAS latency | 38 | Component for | PC | Cooling type | Heatsink | Country of origin | China, Taiwan | ECC | No | Intel Extreme Memory Profile (XMP) | Yes | Intel Extreme Memory Profile (XMP) version | 3.0 | Internal memory | 32 GB | Internal memory type | DDR5 | JEDEC standard | Yes | Lead plating | Gold | Memory channels | Dual-channel | Memory clock speed | 3600 MHz | Memory data transfer rate | 7200 MT/s | Memory form factor | 288-pin DIMM | Memory layout (modules x size) | 2 x 16 GB | Memory ranking | 1 | Memory voltage | 1.45 V | Module configuration | 2048M x 64 | On-Die ECC | Yes | Product colour | Grey, White | Programming power voltage (VPP) | 1.8 V | Refresh row cycle time | 295 ns | Row active time | 32 ns | Row cycle time | 48 ns | SPD profile | Yes | Packaging data | Package depth | 16 mm | Package height | 171.4 mm | Package weight | 164.9 g | Package width | 129.5 mm |
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