The TG Putty Advance 30g thermal pad by Thermal Grizzly is a high-performance, malleable thermal interface material designed to optimize heat transfer between electronic components and cooling solutions. With its unique putty-like consistency, it ensures perfect surface contact even on uneven or irregular surfaces, making it ideal for CPUs, GPUs, memory modules, VRMs, and other sensitive hardware. The product boasts an impressive thermal conductivity of up to 12.5 W/mK and maintains stable performance across a wide temperature range from -50°C to +200°C. Unlike traditional pads or pastes, TG Putty Advance does not dry out over time and can be easily repositioned during installation or maintenance.
Thermal Grizzly is renowned in the PC cooling industry for developing cutting-edge thermal compounds that cater to enthusiasts and professionals alike. Their commitment to quality extends beyond performance; they prioritize environmentally friendly manufacturing processes by minimizing waste production and using recyclable packaging materials wherever possible.
By choosing TG Putty Advance 30g from Thermal Grizzly, customers are not only ensuring optimal cooling efficiency but also supporting sustainable practices within the tech industry. This conscious choice helps reduce environmental impact while delivering top-tier results for demanding applications.